Probe station test function and use | test probes clips

Probe station test function and use | test probes clips

Probe stations are mainly used in semiconductor industry, optoelectronic industry, integrated circuit and packaging testing. It is widely used in the research and development of precision electrical measurement of complex and high-speed devices, aiming at quality and performance, and reducing the research and development time and the cost of the device manufacturing process.

  The main purpose of probe station test

   Test the bonding strength of the gold and aluminum wire solder balls and the breaking strength of the tie wires; the bonding strength of the chip and the Die; the bonding strength of the BGA solder balls.

   performance parameters

  A) The test range of the tensile test can be selected from 0-100G; 0-1KG; 0-10KG;

  B) The test range of the push ball test can be selected from 250G or 5KG;

  C) The chip thrust test range can be tested to 0-100 kg; 0-200KG for selection;

  D) Tweezers tear force test head range is 100G and 5KG for selection;

  E) BGA pulls the ball to 0-100G; 0-5KG for selection;

  Application range

  It is suitable for testing the adhesion of gold and aluminum wires in various semiconductor packaging forms; and COB packaging, optoelectronics, led, SMT assembly, original and substrate adhesion testing
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